Coherent Corp., a photonics manufacturer based in Saxonburg, Pennsylvania, has initiated the distribution of its latest silicon carbide (SiC) substrates to key artificial intelligence semiconductor partners. The company is providing these 300mm high thermal conductivity materials for sampling purposes as part of a customer evaluation phase.
This distribution marks a transition from internal development to external assessment. The move supports Coherent’s efforts to scale its materials platform. The substrates are designed to address the increasing power densities found in artificial intelligence and high-performance computing systems. These systems require effective heat removal, higher power density capabilities, and faster switching speeds.
Coherent first introduced the product in December. Engineers developed the material to manage rising thermal loads within datacenters. The company states that the new substrates improve heat spreading by up to 25 percent compared to current solutions. Additionally, the materials are compatible with existing semiconductor manufacturing platforms.
Craig Mullaney, Coherent’s senior vice president and general manager, highlighted the industry's challenge in removing heat from next-generation processors. He noted that advanced SiC thermal management materials can help address this issue. Mullaney explained that combining decades of silicon carbide expertise with a scalable 300mm manufacturing platform helps build the materials foundation for future AI infrastructure.
Silicon carbide offers high thermal conductivity, mechanical strength, and thermal stability. The shift to 300mm wafers in power electronics allows for more devices per wafer. This transition also reduces the cost per chip.
